Collect - Edge Devices (Sensors & Actuators)

This is the front-most device of any IoT system. It primarily works as either a sensing device to collect physical environment information, or as an actuator to control the outside world with an output. In some cases, edge devices perform a dual role, acting as both a sensing and actuating device to collect and control the physical environment.


The edge node must be connected to the outside network, either through a wired or wireless sensor node (WSN). Data integrity remains key in this block of the signal chain as many IoT systems utilize a large number of sensors to collect data and make intelligent decisions.


An edge node device provides the intelligence to sense, measure, interpret, and connect an internet gateway to the cloud. The data can be pre-processed with some form of analytics before it is transmitted for deeper data mining intelligence.


Processing nodes provides local intelligence to the entire network of sensors and applications. Typically, a processing node involves one or more microcontroller, microprocessor, hybrid circuit, etc. and may be relatively larger in size as compared to end-nodes. Processing nodes are not readily available devices; they are custom made by designers to meet the specific needs of their application.


Bigger IoT applications require a large array of edge devices in order to form a network of edge devices. In such cases, each edge device (node) needs to have a unique identifier in order to recognise and communicate with them effectively.


Typical examples of Edge Devices (Nodes):


Sensors: Temperature, Humidity, Pressure, Gas, Light, Sound, RFID, NFC, Ultrasonics, Flow Meter, Fluid, Cameras, etc


Actuators: Switch, Relays, PLCs, Motors, Light, Sound etc


Videos

TI IoT Week, Sensor Node Project

Smart Occupancy Sensor training video for IoT Solutions from Silicon Labs

Atmel: IoT-Enabled Temperature Sensor Demo

Featured Products

Battery Simulator and Precision DC POwer Supply

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Flick, 3D Tracking and Gesture Sensor, HAT

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PIR Motion Sensors

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Development Kit, IoT Node, Low Power, Wi-Fi, BLE, NFC, 915 MHz (US), Connection to Cloud Servers

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MAXREFDES117#
MAXREFDES117# - Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

2627165

MAXIM INTEGRATED PRODUCTS - Reference Design Board, Optical Heart Rate and Pulse-Oximetry Monitor, Integrated Red and IR LEDs

REF DES BRD, HEART RATE/PULSE OXIMETER; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX30102, MAX14595, MAX1921; Kit Application Type:Sensor; Application Sub Type:Pulse Oximeter & Heart Rate Monitor; Core Architecture:-; Core Sub-

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LDC1000EVM
LDC1000EVM - Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

2360423

TEXAS INSTRUMENTS - Evaluation Module, LDC1000 Inductance to Digital Converter for Inductive Sensing Applications, 5V

INDUCTIVE SENSING, EVALUATION BOARD; Kit Application Type:Data Converter; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC1000; Application Sub Type:Inductance to Digital Converter; Kit Contents:Evaluation Board LDC1000; Product Range:-; S

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EVAL-ADXL377Z
EVAL-ADXL377Z - Breakout Board, ADXL377 3-Axis High g Analog MEMS Accelerometer

2250738

ANALOG DEVICES - Breakout Board, ADXL377 3-Axis High g Analog MEMS Accelerometer

EVALUATION BOARD, 3 AXIS ACCEL; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Analog Devices; Silicon Core Number:ADXL377; Application Sub Type:Accelerometer - Three-Axis; Kit Contents:Evaluation Board ADXL377; Product Range:A

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FRDM-FXS-MULT2-B
FRDM-FXS-MULT2-B - Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope

2520442

NXP - Evaluation Module, MMA8652FC/FXAS21002C/MPL3115A2 3-Axis Accelero/Magneto/Gyroscope

DEV BOARD, FREEDOM PLATFORM; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:NXP; Silicon Core Number:FXLS8471Q, MAG3110, FXAS21002C, MMA8652FC, MPL3115A2, FXOS8700CQ, MMA9553L; Application Sub Type:Sensor; Kit Contents:Freedom

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MAX31855PMB1#
MAX31855PMB1# - Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

2530496

MAXIM INTEGRATED PRODUCTS - Evaluation Module, MAX31855 K-Type Thermocouple to Digital Converter, 14-Bit Output

DEV BOARD, THERMOCOUPLE-DIGITAL; Kit Application Type:Sensing - Temperature; Silicon Manufacturer:Maxim Integrated Products; Silicon Core Number:MAX31855; Application Sub Type:Thermocouple to Digital Converter; Kit Contents:Dev Board MAX31855( K Type The

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AMG8834EK
AMG8834EK - Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

2664539

PANASONIC ELECTRONIC COMPONENTS - Evaluation Board, AMG8834 Infrared Grid-EYE Array Sensor, PAN1740 Bluetooth Low Energy Module

GRID-EYE SENSOR BOARD; Kit Application Type:Sensor; Silicon Manufacturer:Panasonic; Silicon Core Number:AMG8834; Application Sub Type:Infrared Array Sensor; Kit Contents:Grid-EYE Sensor Board, ATSAMD21- SMART, Bluetooth Module; Product Range:-; SVHC:No S

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2011660
2011660 - Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

1272670

LASER COMPONENTS - Evaluation Module, Laser Diode Driver, Integrated Reverse Polarity Protection for IC & Laser Diode

LASER DIODE DRIVER, DEV KIT; Kit Application Type:Drivers; Silicon Manufacturer:Laser Components; Silicon Core Number:-; Application Sub Type:Laser Diode Driver; Kit Contents:Evaluation Board WK Module; Product Range:-; SVHC:No SVHC (15-Jan-2018); Featur

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BRKT-STBC-AGM01
BRKT-STBC-AGM01 - Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

2473788

NXP - Development Platform, FXAS21002C & FXOS8700C 9-Axis Solution, Sensor Shield and Breakout Board

BREAKOUT BOARD, FREEDOM INERTIAL SENSOR; Silicon Manufacturer:NXP; Core Architecture:ARM; Core Sub-Architecture:Cortex-M4; Silicon Core Number:FXAS21002C, FXOS8700CQ; Silicon Family Name:-; For Use With:NXP FRDM-K64F-AGM01 Demonstration kit; Kit Contents

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    HDC1000EVM
    HDC1000EVM - Evaluation Module, Sensor, Temperature & Humidity, Complete HR & Temperature Data Logger

    2451102

    TEXAS INSTRUMENTS - Evaluation Module, Sensor, Temperature & Humidity, Complete HR & Temperature Data Logger

    EVAL BOARD, HDC1000 TEMP/HUMIDITY SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, HDC1000; Application Sub Type:Temperature Sensor & Humidity Sensor; Kit Contents:Eval Board HDC1000; Product R

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    SEK001
    SEK001 - Evaluation Kit, Trustability Pressure Sensors, Digital Output

    2772519

    HONEYWELL - Evaluation Kit, Trustability Pressure Sensors, Digital Output

    SENSOR EVALUATION KIT, PRESSURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Honeywell; Silicon Core Number:-; Application Sub Type:Board Mount Pressure Sensors; Kit Contents:Sensor Evaluation Kit; Product Range:-; SVHC:No SVHC (07-Jul-2017)

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    LDC1614EVM
    LDC1614EVM - Evaluation Module, LDC1614 28-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

    2471703

    TEXAS INSTRUMENTS - Evaluation Module, LDC1614 28-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

    EVAL BOARD, LDC1614; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, LDC1614; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1314; Product Range:-; SVHC:No SVHC (15-Ja

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    FDC2114EVM
    FDC2114EVM - Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

    2535921

    TEXAS INSTRUMENTS - Evaluation Module, FDC2114 12-Bit Capacitive Sensing Solution, Proximity Sensing, 4 Channel

    EVAL BOARD, FDC2114 CAP-TO-DIGITAL CONV; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2114; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Evaluation Boa

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    SENSEKIT2-EVK-101
    SENSEKIT2-EVK-101 - Evaluation Kit, LAPIS MCU, 6x Analog and Digital Ambient Light Sensor IC's, Hot Pluggable Design

    2475523

    ROHM - Evaluation Kit, LAPIS MCU, 6x Analog and Digital Ambient Light Sensor IC's, Hot Pluggable Design

    EVAL BOARD, ML610Q112 SENSOR PLATFORM; Kit Application Type:Sensor; Silicon Manufacturer:-; Silicon Core Number:ML610Q112, BU52011HFV, BH1620FVC, BH1721FVC, ML8511, KMX61, BDE0600G; Application Sub Type:Embedded; Kit Contents:Sensor Platform Base Board,

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    OM13081UL
    OM13081UL - Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

    2471049

    NXP - Evaluation Module, LPC82x Capacitive Touch Solution, 8-Bit Touchpad, 9 Keys, LCD

    DEMO BOARD, CAP TOUCH SOLUTION; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:NXP; Silicon Core Number:LPC824; Application Sub Type:Capacitive Touch; Kit Contents:Dev Board LPC824, LPC82x Touch Shield, USB Cable; Product Range:-;

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    SI7057-EVB
    SI7057-EVB - Evaluation Kit, Si705x Processor Family, Temperature Sensor, USB Dongle Form Factor

    2769165

    SILICON LABS - Evaluation Kit, Si705x Processor Family, Temperature Sensor, USB Dongle Form Factor

    EVAL BOARD, DIGITAL TEMPERATURE SENSOR; Kit Application Type:Sensor; Silicon Manufacturer:Silicon Laboratories; Silicon Core Number:Si7057, Si7058 & Si7059; Application Sub Type:Temperature Sensor; Kit Contents:USB Dongle Control & Si7057-EB Postage Stam

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    DM160225
    DM160225 - Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

    2448429

    MICROCHIP - Evaluation Board, PC Peripheral, 3DTouchPad, Extends 2D Touch Pad with 3D Gestures

    DEV BOARD, PCAP SENSOR 3D TOUCH PAD; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Microchip; Silicon Core Number:MTCH63104, MGC3130; Application Sub Type:3D Tracking & Gesture Controller; Kit Contents:3DTouchPad, USB Cable, Infor

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    FDC2214EVM
    FDC2214EVM - Evaluation Module, FDC2214 28-Bit Capacitance to Digital Converter, Small Form Factor

    2499241

    TEXAS INSTRUMENTS - Evaluation Module, FDC2214 28-Bit Capacitance to Digital Converter, Small Form Factor

    EVAL BRD, FDC2214 CAPACITANCE TO DIGITAL; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, FDC2214; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval Board MS

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    LDC0851EVM
    LDC0851EVM - Evaluation Module, LDC0851 High Accuracy Inductive Switch, Stacked Coil, Push / Pull Output

    2531097

    TEXAS INSTRUMENTS - Evaluation Module, LDC0851 High Accuracy Inductive Switch, Stacked Coil, Push / Pull Output

    EVALUATION BOARD, INDUCTIVE SWITCH; Kit Application Type:Sensing - Touch, Proximity; Silicon Manufacturer:Texas Instruments; Silicon Core Number:LDC0851; Application Sub Type:Inductive Proximity Switch; Kit Contents:Eval Board LDC0851, USB Cable; Product

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    LDC1612EVM
    LDC1612EVM - Evaluation Module, LDC1612 12-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

    2471702

    TEXAS INSTRUMENTS - Evaluation Module, LDC1612 12-Bit Inductance to Digital Converter, Sample PCB Sensor Coils

    EVAL BOARD, LDC1612; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528, LDC1612; Application Sub Type:Sensor; Kit Contents:Eval Board LDC1612; Product Range:-; SVHC:No SVHC (15-Ja

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    OPT3001EVM
    OPT3001EVM - Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

    2471704

    TEXAS INSTRUMENTS - Evaluation Module, OPT3001 Ambient Light Sensor, Digital Output Integrated Circuit

    EVALUATION BOARD, LIGHT SENSOR; Kit Application Type:Sensing - Navigation, Position; Silicon Manufacturer:Texas Instruments; Silicon Core Number:OPT3001; Application Sub Type:Light to Digital Converter; Kit Contents:Eval Board OPT3001, SM-USB DIG Board,

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    XTRINSIC-SENSORS-EVK
    XTRINSIC-SENSORS-EVK - Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

    2308734

    NXP - Evaluation Kit for NXP Xtrinsic Sensors using FRDM-KL25Z Platform

    EVAL KIT, XTRINSIC SENSOR + KL25 BOARD; Silicon Manufacturer:NXP; Silicon Core Number:KL25Z, MAG3110, MMA8491, MPL3115; Kit Application Type:Sensing - Sampling Kit / Related Components; Application Sub Type:-; Kit Contents:Xtrinsic Sensor Board, Freedom

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    FDC1004QEVM
    FDC1004QEVM - Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

    2535928

    TEXAS INSTRUMENTS - Evaluation Module, FDC1004-Q1 Automotive 4-Channel Capacitive to Digital Converter, Plug & Play

    EVAL BRD, FDC1004-Q1 CAP-TO-DIGITAL CONV; Kit Application Type:Sensor Signal Conditioner; Silicon Manufacturer:Texas Instruments; Silicon Core Number:MSP430F5528IRGCT, FDC1004-Q1; Application Sub Type:Capacitance-to-Digital Converter; Kit Contents:Eval B

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    ADPD105BCPZ
    ADPD105BCPZ - PHOTOMETRIC FRONT END, LFCSP-28

    2725084

    ANALOG DEVICES - PHOTOMETRIC FRONT END, LFCSP-28

    PHOTOMETRIC FRONT END, LFCSP-28; IC Function:Photometric Front End; Supply Voltage Min:1.7V; Supply Voltage Max:1.9V; IC Package Type:LFCSP; No. of Pins:28Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product Range:-; MSL:MSL 3 -

    Já não existe em stock

    MPU6000 DEV BOARD
    MPU6000 DEV BOARD - Development Board, MPU6000 Triple Axis Gyroscope & Accelerometer, 6-Axis Motion Processing

    2082446

    INVENSENSE - Development Board, MPU6000 Triple Axis Gyroscope & Accelerometer, 6-Axis Motion Processing

    MPU6000, GYRO, I2C, SPI, EVAL BOARD; Tipo de Aplicación de Kit:Sensor; Fabricante del Núcleo de Silicio:-; Número del Núcleo de Silicio:-; Subtipo de Aplicación:Giroscopio y Acelerómetro de Triple Eje; Contenido del Kit:MPU-6000 Digital Motion Processing

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    1+ 71,51 €

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    EK-H5
    EK-H5 - Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

    1855471

    SENSIRION - Evaluation Kit for SHT2x and SHT7x Humidity and Temperature Sensors

    EVALUATION KIT, HUMIDITY, FOR SHT2X/7X; Kit Application Type:Sensor; Silicon Manufacturer:Sensirion; Silicon Core Number:SHT21; Application Sub Type:Humidity Sensor; Kit Contents:EK-H5 USB Stick, SHT21 Sensor, Sensor Cable; Product Range:-; SVHC:No SVHC

    Já não é fabricado