Molex's connector portfolio supports a wide range of data rates in multiple sizes & shapes and exceeds performance requirements for telecommunications and data center applications. High speed interconnect solutions allow the required flexibility and scalability to meet the needs of 5G, edge computing and an evolving cloud.


Applications

Infrastructure

Infrastructure

Switch/ Router

Switch/ Router

Server

Server

Storage

Storage

Power

Power

Networking

Networking

Featured Products

Modular Jacks

Efficient production processes deliver cost-effective Modular Jacks that ensure high-performance and superior reliability across a wide range of Ethernet data speeds.

Key features & benefits
  • Cat 3, Cat 5 and Cat 5e speeds available
  • RJ11 and RJ45 jacks in right-angle, vertical top/bottom-entry styles
  • 4, 6 and 8 contacts available
  • Low-profile versions available
  • Shielding available for both plugs and jacks
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SFP+ and SFP Interconnect System

High speed SFP+ and SFP products ensure industry-wide compatibility and supporting 2.5 to 10Gbps data rates for gigabit Ethernet and fibre channel applications.

Key features & benefits
  • Press-fit tails accommodates belly-to-belly applications for single and ganged cages
  • Integrated lightpipes for use with SMT Light Emitting Diodes (LEDs)
  • Modules oriented 'belly-to-belly' when inserted
  • Ganged cages have 360° elastomeric gaskets, spring fingers and multiple ground-pin locations
  • Unique thumb latch
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Mirror Mezz Connectors

Footprint compatible hermaphroditic Mirror Mezz Connectors lower application costs with stackable mating to support data speeds up to 56 Gbps per differential pair for telecommunications, networking and other applications.

Key features & benefits
  • Enables easy achievement of the desired mated height to meet application requirements
  • Intricately designed terminal structure
  • Two electrically tuned signal contacts
  • Stitched BGA design
  • Robust shrouded housing design
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Nano-Pitch I/O Interconnect System

Redefining solutions in the storage, mobile, and enterprise industries, Molex’s Nano-Pitch I/O (NPIO) connectors and cable assemblies offer industry-leading port density, multi-protocol support, and enhanced signal integrity to support PCIe’s OCuLink and SAS-4 (MiniLink) applications.

Key features & benefits
  • Flexible pinout concept optimized for high-speed applications
  • Small form factor design
  • Mezzanine and parallel solutions available
  • Staggered, reliable and constant dual-row contact configuration
  • Multi-protocol solution that adheres to a variety of industry standards
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SEARAY and SEARAY Slim Mezzanine Family

Low profile SEARAY Mezzanine Connectors and Jumpers deliver a 12.5+ Gbps data rate, small footprint and robust solder-charge termination while SEARAY Slim Connectors also improve airflow to address thermal management issues.

Key features & benefits
  • Multiple stack heights and circuit options
  • Patented solder-charge technology: Solder precisely stamped onto terminals
  • Robust guiding pins on both ends of the connector and polarization design
  • Large lead-in and shrouded terminal housing
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DDR4 DIMM Sockets

Meeting JEDEC specifications, these high-speed sockets offer greater PCB real-estate and cost savings with excellent assembly-processing compatibility.

Key features & benefits
  • Reduced connector footprint of 6.50mm (max.) (W) by 162mm (L)
  • Profiled contact terminals
  • High connector durability
  • Robust and more ergonomic latch design
  • Use of less moisture-sensitive, high-temperature housing material
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QSFP-DD Interconnect System and Cable Assemblies

The QSFP-DD interconnect system’s 8-lane electrical interface transmits up to 28Gbps NRZ or 56Gbps PAM-4, up to 200Gpbs or 400Gbps aggregate, with the same module form factor as QSFP interconnects, making them backward compatible.

Key features & benefits
  • 28 Gbps NRZ and 56 Gbps PAM4
  • Preferential coupling design
  • Stacked integrated connectors and cages are available in 2-by-1 configuration
  • Stitched BGA design
  • Meets IEEE 802.3bj, InfiniBand EDR and SAS 3.0 specifications
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iPass Interconnect Solutions

iPass Interconnect Solutions provide host board and backplane connectors, as well as cable assemblies for SAS, PCIe, Ethernet, InfiniBand and Fibre Channel internal and external systems.

Key features & benefits
  • Screw attachment for the guide frame to the PCB
  • Internal cables provide tight skew control and low cross talk
  • Reduced external cable plug width
  • External SMT host connector with alignment posts and standoffs
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High-Speed I/O Connectors

High-Speed I/O Connectors