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SMD291SNL10
Solder Paste, No Clean, Sn96.5/Ag3.0/Cu0.5, 217°C, 35g
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ManufacturerCHIP QUIK
Manufacturer Part NoSMD291SNL10
Order Code1850225
Product RangeChip Quik - No-Clean Solder Paste
Technical Datasheet
157 In Stock
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| Quantity | Price (ex VAT) |
|---|---|
| 1+ | €37.660 |
| 3+ | €35.820 |
Price for:Each
Minimum: 1
Multiple: 1
€37.66 (ex VAT)
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Product Information
ManufacturerCHIP QUIK
Manufacturer Part NoSMD291SNL10
Order Code1850225
Product RangeChip Quik - No-Clean Solder Paste
Technical Datasheet
Flux TypeNo Clean
Solder Alloy96.5, 3, 0.5 Sn, Ag, Cu
Melting Temperature217°C
Weight - Metric35g
Weight - Imperial1.23oz
Product RangeChip Quik - No-Clean Solder Paste
SVHCNo SVHC (23-Jan-2024)
Product Overview
No-clean, lead-free solder paste in syringe applicator with plunger and tip.
- Printing speeds up to 100mm/sec
- Long stencil life
- Wide process window
- Clear residue
- Low voiding
- Excellent wetting compatibility on most board finishes
- Dispense grade
- Compatible with enclosed print heads
- Passes BONO test @ 1.56%
- Alloy: Sn96.5/Ag3/Cu0.5
- Shelf life: <gt/>6 months (refrigerated), <gt/>2 months (unrefrigerated)
Technical Specifications
Flux Type
No Clean
Melting Temperature
217°C
Weight - Imperial
1.23oz
SVHC
No SVHC (23-Jan-2024)
Solder Alloy
96.5, 3, 0.5 Sn, Ag, Cu
Weight - Metric
35g
Product Range
Chip Quik - No-Clean Solder Paste
Technical Docs (2)
Associated Products
1 Product Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:38101000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (23-Jan-2024)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.052